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Chengbo Liu

Researcher at Shenzhen University

Publications -  6
Citations -  1304

Chengbo Liu is an academic researcher from Shenzhen University. The author has contributed to research in topics: Ceramic & Particle size. The author has an hindex of 4, co-authored 6 publications receiving 620 citations.

Papers
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3D printing of ceramics: A review

TL;DR: A review on the latest advances in the 3D printing of ceramics and present the historical origins and evolution of each related technique is presented in this paper. And the main technical aspects, including feedstock properties, process control, post-treatments and energy source-material interactions, are also discussed.
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Preparation of high solid loading and low viscosity ceramic slurries for photopolymerization-based 3D printing

TL;DR: In this article, high solid loading and low viscosity cordierite slurries are successfully developed for the first time for photopolymerization-based additive manufacturing, which is mainly determined by their rheological properties and photocuring parameters.
Journal ArticleDOI

Mechanical properties and microstructures of 3D printed bulk cordierite parts

TL;DR: In this paper, the effect of particle size of the prepared cordierite slurries, the predefined sliced layer thickness and the exposure time on the sample quality was evaluated via orthogonal experiments.
Journal ArticleDOI

Dimensional retention of photocured ceramic units during 3D printing and sintering processes

TL;DR: In this paper, photocuring-based digital light processing (DLP) 3D printing technology was used to prepare basic photocuring units from cordierite ceramic slurries loaded with three different average particle sizes.
Patent

Cordierite ceramic slurry for 3D printing and preparation method thereof

TL;DR: In this article, a cordierite ceramic slurry for 3D printing and a preparation method thereof is presented. But the slurry has good dispersion stability, can be stored for a long time without being separated by precipitation under the condition of avoiding light, and can be directly used for light-cured 3D printed devices.