Daniel J. Laser

TL;DR: In this article, the authors survey progress over the past 25 years in the development of microscale devices for pumping fluids and attempt to provide both a reference for micropump researchers and a resource for those outside the field who wish to identify the best micropumps for a particular application.

TL;DR: In this article, the authors describe an electroosmotic pump that is capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as associated reduction in reliability.

TL;DR: In this paper, the authors describe an approach that uses micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability.

TL;DR: In this paper, the authors developed a class of electroosmotic micropumps fabricated from silicon substrates that can be used for integrated circuit thermal management applications, achieving a maximum flow rate of 170 /spl mu/L min/sup -1/ and a maximum pressure of 10 kPa operating at 400 V.

TL;DR: It is suggested that engineered microbubbles enable stone-treatment modalities with driving pressures significantly lower than those required without the microbubble, as well as surface erosion and formation of microcracks from the action of microbubbling.