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Proceedings ArticleDOI

Silicon electroosmotic micropumps for integrated circuit thermal management

TLDR
In this paper, the authors developed a class of electroosmotic micropumps fabricated from silicon substrates that can be used for integrated circuit thermal management applications, achieving a maximum flow rate of 170 /spl mu/L min/sup -1/ and a maximum pressure of 10 kPa operating at 400 V.
Abstract
We are developing a class of electroosmotic micropumps fabricated from silicon substrates that can be used for integrated circuit thermal management applications. Prototype micropumps with 0.15 cm/sup 3/ packages produce a maximum flow rate of 170 /spl mu/L min/sup -1/ and a maximum pressure of 10 kPa operating at 400 V. These specifications approach the requirements for single-phase forced-convective cooling of small IC hot spots. The micropumps operate on less than 200 mW and, having no moving structural elements, offer inherent reliability advantages. The impact on pump performance of geometry, surface treatment, and choice of working fluid has been characterized.

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Citations
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Journal ArticleDOI

A review of micropumps

TL;DR: In this article, the authors survey progress over the past 25 years in the development of microscale devices for pumping fluids and attempt to provide both a reference for micropump researchers and a resource for those outside the field who wish to identify the best micropumps for a particular application.
Journal ArticleDOI

A magnetically driven PDMS micropump with ball check-valves

TL;DR: In this article, a PDMS-membrane micropump with two one-way ball check-valves for lab-on-a-chip and microfluidic applications is presented.
Journal ArticleDOI

A programmable planar electroosmotic micropump for lab-on-a-chip applications

TL;DR: In this article, a programmable planar micropump for lab-on-a-chip applications has been developed, which consists of an electroosmotic micro pump combined with a mass flow sensor in a closed control loop.
Proceedings ArticleDOI

A magnetically driven PDMS peristaltic micropump

TL;DR: A preliminary numerical analysis of the peristaltic pump was performed, which showed the characteristic membrane deflection and fluid flow of pumping.
Journal ArticleDOI

Assessment of an active-cooling micro-channel heat sink device, using electro-osmotic flow

TL;DR: In this article, an active cooling micro-channel heat sink device that can operate under atmospheric pressure while achieving high heat dissipation rate with a reduced chip-backside volume is presented.
References
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Journal ArticleDOI

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

TL;DR: This paper analyzes the limitations of the existing interconnect technologies and design methodologies and presents a novel three-dimensional chip design strategy that exploits the vertical dimension to alleviate the interconnect related problems and to facilitate heterogeneous integration of technologies to realize a system-on-a-chip (SoC) design.
Journal ArticleDOI

A planar electroosmotic micropump

TL;DR: In this paper, an analytical model applicable to planar, etched-structure electroosmotic (EO) micropumps has been developed and applied to guide the design of a pump consisting of an etched EO flow chamber for near-optimal hydraulic power performance.
Journal ArticleDOI

Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions

TL;DR: In this paper, the authors developed single and multi-channel experimental structures using plasma-etched silicon with pyrex glass cover, which allow uniform heating and spatially-resolved thermometry and provide optical access for visualization of boiling regimes.
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