Mechanisms controlling the durability of thermal barrier coatings

▪ Abstract The emphasis in this short review is to describe the materials issues involved in the development of present thermal barrier coatings and the advances necessary for the next generation, higher temperature capability coatings.

Materials design for the next generation thermal barrier coatings

The addition of reactive elements can have a significant effect on the oxidation behavior of alumina- and chromia-forming alloys. A model has been developed to explain the effects associated with the addition of reactive elements that is based on the segregation of reactive-element ions to scale grain boundaries and the metal-oxide interface. Reactive-element ions use these interaces as pathways for diffusion from the metal substrate to the gas interface of the scale. The driving force for this outward diffusion is the oxygen potential gradient across the scale. Doping of the scale grain boundaries results in scale growth primarily by inward oxygen diffusion, while doping at the metal-oxide interface slows the growth of interfacial voids and thus improves scale adhesion.

Experimental observations in support of the dynamic-segregation theory to explain the reactive-element effect

Some of the important principles that determine the establishment, growth and long-term maintenance of protective Cr2O3, Al2O3 and SiO2 scales on hightemperature iron-, nickel- and cobalt-base alloys are reviewed and discussed. Emphasis is placed on the effects of alloying elements and other additions, such as third elements and reactive elements or oxide dispersions, on each of these processes. Particular attention is paid to transport processes in the scales and the importance of short-circuit paths. Some of the important parameters that influence the long-term mechanical stability of such scales are considered and evaluated.

The influence of alloying elements on the development and maintenance of protective scales

Over the past several years, the steady reduction in SOFC operating temperatures to the intermediate range of 700~850oC [1] has made it feasible for lanthanum chromite to be supplanted by metals or alloys as the interconnect materials. Compared to doped lanthanum chromite, metals or alloys offer significantly lower raw material and fabrication costs. However, to be a durable and reliable, a metal or alloy has to satisfy several functional requirements specific to the interconnect under SOFC operating conditions. Specifically, the interconnect metal or alloy should possess the following properties: (i) Good surface stability (resistance to oxidation, hot corrosion, and carburization) in both cathodic (air) and anodic (fuel) atmospheres; (ii) Thermal expansion matching to the ceramic PEN (positive cathode-electrolyte-negative anode) and seal materials (as least for a rigid seal design); (iii) High electrical conductivity through both the bulk material and in-situ formed oxide scales; (iv) Bulk and interfacial thermal mechanical reliability and durability at the operating temperature; (v) Compatibility with other materials in contact with interconnects such as seals and electrical contact materials.

https://iopscience.iop.org/article/10.1149/1.1595659/pdf

Selection and Evaluation of Heat-Resistant Alloys for SOFC Interconnect Applications

Currentunderstanding of the complex interrelationships among growth kinetics, microstructure, and adhesion of protective Cr2O3 and Al2O3 scales is critically reviewed. Similarities and differences in the behavior of these two systems are highlighted. The morphology of the alloy-scale interface appears to be a critical factor. Recent ideas are advanced to interpret the effect of oxygen-active elements on the development of a tortuous interface conducive to improved scale tenacity.

/pdf/microstructure-adhesion-and-growth-kinetics-of-protective-2v2aeq1h8a.pdf

H. Hindam

Papers

Microstructure, adhesion and growth kinetics of protective scales on metals and alloys