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Shuichi Nagasawa

Researcher at National Institute of Advanced Industrial Science and Technology

Publications -  78
Citations -  1209

Shuichi Nagasawa is an academic researcher from National Institute of Advanced Industrial Science and Technology. The author has contributed to research in topics: Josephson effect & Chemical-mechanical planarization. The author has an hindex of 16, co-authored 76 publications receiving 1117 citations. Previous affiliations of Shuichi Nagasawa include NEC.

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A 380 ps, 9.5 mW Josephson 4-Kbit RAM operated at a high bit yield

TL;DR: In this article, a Josephson 4-Kbit RAM with improved component circuits and a device structure having two Nb wiring layers was developed, where a resistor coupled driver and sense circuit were improved to have wide operating margins.
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100 GHz demonstrations based on the single-flux-quantum cell library for the 10 kA/cm 2 Nb multi-layer process

TL;DR: In this article, a single flux quantum (SFQ) logic cell library has been developed for the 10kA/cm 2 Nb multi-layer fabrication process to efficiently design large-scale SFQ digital circuits.
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High-frequency clock operation of Josephson 256-word/spl times/16-bit RAMs

TL;DR: In this article, a Josephson 256-word/spl times/16-bit RAM that includes a power circuit has been developed to enable high-frequency clock operation, and the 256 RAM block functioned up to a clock frequency of 1.07 GHz.
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A 4-kbit Josephson nondestructive read-out RAM operated at 580 psec and 6.7 mW

TL;DR: The 4-kb Josephson high-speed RAM with vortex transitional memory cells was designed and operated successfully as discussed by the authors, which is composed of 64-b*64b cells, polarity-convertible drivers, address decoders using resistor coupled Josephson logic (RCJL) gates, and a resistively loaded sense circuit.
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Improvements in Fabrication Process for Nb-Based Single Flux Quantum Circuits in Japan

TL;DR: An Nb-based fabrication process for single flux quantum (SFQ) circuits in a Japanese government project was improved by overhauling all the process steps and routine process checks for all wafers and wafer yield dramatically increased.