Xibin Wang

TL;DR: In this article, an elliptical ultrasonic vibrator attached with a sapphire substrate was set up on a multi-axis CNC controlled machining center equipped with a single point diamond tool, and the effects of ultrasonic vibration on the critical depth of cut a c for the ductile-brittle transition region and the material removal ratio were investigated by the examination of the scratching groove surfaces with SEM and AFM.

TL;DR: In this article, a two-dimensional ultrasonic assisted grinding (UAG) technique is proposed to achieve high material removal rate and high surface quality in the machining of hard and brittle materials such as monocrystal silicon.

TL;DR: In this paper, a series of grinding experiments under the presence/absence of ultrasonic vibration assistance are performed, and the grinding forces and work-surface roughness are measured, while the wheel surface is examined too.

TL;DR: The calculations here show that the band structure of bilayer MoS2 changes from indirect at room temperature toward direct nature as temperature decreases, which enables the electrical tunability of the K-K direct PL transition in bilayerMoS2 at low temperature.

TL;DR: In this article, the defect formation mechanism of SiC particle-reinforced aluminum matrix (SiCp/Al) composite was investigated and a defect model was constructed to investigate the milling process of the SiCP/Al composite.