Yongbo Wu

TL;DR: In this article, an elliptical ultrasonic vibrator attached with a sapphire substrate was set up on a multi-axis CNC controlled machining center equipped with a single point diamond tool, and the effects of ultrasonic vibration on the critical depth of cut a c for the ductile-brittle transition region and the material removal ratio were investigated by the examination of the scratching groove surfaces with SEM and AFM.

TL;DR: In this article, a two-dimensional ultrasonic assisted grinding (UAG) technique is proposed to achieve high material removal rate and high surface quality in the machining of hard and brittle materials such as monocrystal silicon.

TL;DR: In this article, the authors investigated the material removal mechanism in UAG of silicon carbide (SiC) ceramics by investigating the material deformation/fracture behavior and the scratching forces.

TL;DR: In this paper, an elliptic vibration-assisted (EVA) technique was developed to effectively cut fiber-reinforced polymer (FRP) composites using a simple tool, where a novel vibrator was invented to work at the anti-resonant frequency to realize stable and high variational velocities.

TL;DR: In this paper, a series of grinding experiments under the presence/absence of ultrasonic vibration assistance are performed, and the grinding forces and work-surface roughness are measured, while the wheel surface is examined too.