Q
Qiang Li
Researcher at Nanjing University of Science and Technology
Publications - 25
Citations - 1286
Qiang Li is an academic researcher from Nanjing University of Science and Technology. The author has contributed to research in topics: Thermal contact conductance & Thermal conductivity. The author has an hindex of 13, co-authored 24 publications receiving 1106 citations.
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Journal ArticleDOI
Convective heat transfer and flow characteristics of Cu-water nanofluid
Qiang Li,Yimin Xuan +1 more
TL;DR: In this article, an experimental system was built to investigate convective heat transfer and flow characteristics of the nanofluid in a tube, and the effects of such factors as the volume fraction of suspended nanoparticles and the Reynolds number on the heat transfer was discussed in detail.
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Experimental investigations on transport properties of magnetic fluids
Qiang Li,Yimin Xuan,Jian Wang +2 more
TL;DR: In this paper, the effects of the volume fraction of the suspended magnetic particles, concentration of surfactants and the external magnetic field strength as well as its orientation on the transport properties of the magnetic fluid are analyzed.
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Experimental investigation on heat transfer characteristics of magnetic fluid flow around a fine wire under the influence of an external magnetic field
Qiang Li,Yimin Xuan +1 more
TL;DR: In this article, an experimental investigation was conducted to get insight into convective heat transfer features of the aqueous magnetic fluid flow over a fine wire under the influence of an external magnetic field.
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Investigation on transient behaviors of flat plate heat pipes
Yimin Xuan,Yuping Hong,Qiang Li +2 more
TL;DR: In this article, the performance and mechanism of a flat plate heat pipe (FPHP) with a layer of sintered copper powder is investigated by means of both experimental and theoretical approaches.
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Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials
TL;DR: In this paper, the authors introduce the methods for improving and characterizing the thermal properties of graphene filled polymer composite TIMs, and the challenges facing graphene filled poly-mer composites for thermal management applications in the modern electronic industry and the further progress required in this field are discussed.