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Journal ArticleDOI

A feasibility study on elliptical ultrasonic assisted grinding of sapphire substrate

TLDR
In this paper, an elliptical ultrasonic vibrator is designed and produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body.
Abstract
An elliptical ultrasonic assisted grinding method is proposed for the machining of sapphire substrate in order to improve the machining efficiency and the work-surface quality. An elliptical ultrasonic vibrator is designed and produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body. The sapphire substrate is fixed onto the top face of the vibrator and ultrasonically vibrates in two dimensional (2D) vibration mode when the PZT is excited by two alternating current voltages with a phase difference. Grinding experiments are carried out with lateral modulation of elliptical vibration vertical to grinding speed direction. Experimental results show that grinding forces decrease significantly by 30% and grinding force ratio is reduced and surface roughness is improved by 15%, moreover surface fractures and cracks decrease obviously by using vibration compared with those of conventional grinding. These demonstrate that two-dimensional ultrasonic grinding is effective for high performance machining of sapphire substrate.

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Journal ArticleDOI

Experimental study on brittle–ductile transition in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain

TL;DR: In this article, an elliptical ultrasonic vibrator attached with a sapphire substrate was set up on a multi-axis CNC controlled machining center equipped with a single point diamond tool, and the effects of ultrasonic vibration on the critical depth of cut a c for the ductile-brittle transition region and the material removal ratio were investigated by the examination of the scratching groove surfaces with SEM and AFM.
Journal ArticleDOI

An investigation on wear mechanism of resin-bonded diamond wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire

TL;DR: In this paper, a series of grinding experiments under the presence/absence of ultrasonic vibration assistance are performed, and the grinding forces and work-surface roughness are measured, while the wheel surface is examined too.
Journal ArticleDOI

Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter

TL;DR: In this paper, the deformation features of (0001) C-plane sapphire in ultrasonic vibration-assisted scratch (UVAS) tests were compared with those in traditional scratch tests, which revealed that the UVAS process can reduce scratch loads, effectively inhibit microcrack propagation, and improve the plastic removal proportion, which was rationalized with elastic and residual stress field calculations.
Journal ArticleDOI

Ultrasonic assisted grinding of advanced materials for biomedical and aerospace applications—a review

TL;DR: In this article, a review on ultrasonic-assisted grinding of advanced materials, specifically investigating the effects of ultrasonication on material removal rates (MRR), grinding forces and energy, tool wears, wheel loading, residual stress and surface/subsurface damages were also investigated.
Journal ArticleDOI

Environment-friendly technological advancements to enhance the sustainability in surface grinding- A review

TL;DR: A comprehensive review on surface grinding, which covers all technological issues related to the process, including modelling and simulation, has been reported in this paper, which discusses critical findings pertaining to these advancements and gives recommendations related to surface grinding.
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