International Journal of Abrasive Technology 

About: International Journal of Abrasive Technology is an academic journal published by Inderscience Publishers. The journal publishes majorly in the area(s): Grinding & Abrasive. It has an ISSN identifier of 1752-2641. Over the lifetime, 200 publications have been published receiving 1150 citations. The journal is also known as: Abrasive technology & IJAT.

Grinding characteristics of engineering ceramics in high speed regime

Abstract: This paper summarises the high speed grinding characteristics of engineering ceramics. The performance in high speed grinding was compared with that of conventional speed grinding. Normal and tangential grinding forces and Acoustic Emission (AE) energy were measured to characterise the material removal characteristics of five polycrystalline ceramics. It was found that the microstructure and properties of the ceramic materials have significant influence on the removal and formation of their ground surfaces. Experimental results also demonstrated that grinding-induced vibration and coolant supply in high speed grinding of engineering ceramics are critical factors for achieving a satisfactory grinding performance.

Investigation into temperature field of nano-zirconia ceramics precision grinding

Abstract: A heat transfer model for the precision grinding process on nano-zirconia ceramics has been investigated. Based on the analysis of the processing properties of nano-zirconia ceramic materials, a theoretical model for the temperature field in the grinding of nano-zirconia ceramics was established. The model was then simulated and analysed under different grinding conditions. The effect of temperature dependent thermal properties and heat flux profile on temperature distribution in the workpiece has also been investigated. Parametric studies were carried out to study the effect of different input parameters such as the depth of cut, work feed rate and grinding speed on temperature distribution in the contact zone and in the workpiece across the grinding width and along the direction of movement. The results showed that, as the grinding wheel cut into the workpiece, the workpiece temperature rose sharply, and then levelled-off, with a high temperature gradient on the surface of workpiece. As the grinding depth of cut increased, a local high temperature took place in the grinding contact zone.

Performance of abrasives used in magnetically assisted finishing: a state of the art review

Abstract: Modern aerospace and electronic industries make frequent use of the difficult to machine materials. The micro machining of these materials with conventional edged tool is uneconomical with poor quality of the surface. A relatively new micromachining technology based on magnetic assistance has been used in the recent past to produce quality surface finish on these materials. The magnetic abrasives play an essential role of cutting tools in these processes. However, the magnetic abrasives are not easily available as these are produced by special techniques. This paper highlights major existing technologies that are used to manufacture magnetic abrasives. Main performance characteristics of magnetic abrasives have also been reviewed as regards to micromachining of various surfaces.

Fabrication and evaluation for extremely thin Si wafer

Abstract: Grinding process on the Si wafer develops subsurface damage, which remarkably degrades deflective strength of the wafer and constitutes a barrier against producing a thin wafer for low-profile packaging. In this paper, the authors propose a new index for evaluation of the Degree of Subsurface Damage (DSD). Requiring no costly instrument, the new index is easily calculated via the external geometry of the ground wafer. With the new index, it is able to quantitatively evaluate the subsurface damage introduced by different processes (or wheel) and to estimate the minimally achievable thickness of the wafer by each process. Also, a novel fixed abrasive process of Chemo-Mechanical Grinding (CMG) has been proposed for stress relief. All results indicate that the subsurface damage after CMG is nearly zero.

A feasibility study on elliptical ultrasonic assisted grinding of sapphire substrate

Abstract: An elliptical ultrasonic assisted grinding method is proposed for the machining of sapphire substrate in order to improve the machining efficiency and the work-surface quality. An elliptical ultrasonic vibrator is designed and produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body. The sapphire substrate is fixed onto the top face of the vibrator and ultrasonically vibrates in two dimensional (2D) vibration mode when the PZT is excited by two alternating current voltages with a phase difference. Grinding experiments are carried out with lateral modulation of elliptical vibration vertical to grinding speed direction. Experimental results show that grinding forces decrease significantly by 30% and grinding force ratio is reduced and surface roughness is improved by 15%, moreover surface fractures and cracks decrease obviously by using vibration compared with those of conventional grinding. These demonstrate that two-dimensional ultrasonic grinding is effective for high performance machining of sapphire substrate.