Nanocrystals (NCs) discussed in this Review are tiny crystals of metals, semiconductors, and magnetic material consisting of hundreds to a few thousand atoms each. Their size ranges from 2-3 to about 20 nm. What is special about this size regime that placed NCs among the hottest research topics of the last decades? The quantum mechanical coupling * To whom correspondence should be addressed. E-mail: dvtalapin@uchicago.edu. † The University of Chicago. ‡ Argonne National Lab. Chem. Rev. 2010, 110, 389–458 389

/pdf/prospects-of-colloidal-nanocrystals-for-electronic-and-3dxpyhl3r7.pdf

Prospects of Colloidal Nanocrystals for Electronic and Optoelectronic Applications

Phase-change materials are some of the most promising materials for data-storage applications. They are already used in rewriteable optical data storage and offer great potential as an emerging non-volatile electronic memory. This review looks at the unique property combination that characterizes phase-change materials. The crystalline state often shows an octahedral-like atomic arrangement, frequently accompanied by pronounced lattice distortions and huge vacancy concentrations. This can be attributed to the chemical bonding in phase-change alloys, which is promoted by p-orbitals. From this insight, phase-change alloys with desired properties can be designed. This is demonstrated for the optical properties of phase-change alloys, in particular the contrast between the amorphous and crystalline states. The origin of the fast crystallization kinetics is also discussed.

Phase-change materials for rewriteable data storage

Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally-renowned authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model, and SiGe-base bipolar devices.

/pdf/fundamentals-of-modern-vlsi-devices-471xd7l9pf.pdf

Fundamentals of Modern VLSI Devices

http://www.cs.unibo.it/~montesi/CBD/Articoli/SurvyBigData2.pdf

Data-intensive applications, challenges, techniques and technologies: A survey on Big Data

Memory scaling is in jeopardy as charge storage and sensing mechanisms become less reliable for prevalent memory technologies, such as DRAM. In contrast, phase change memory (PCM) storage relies on scalable current and thermal mechanisms. To exploit PCM's scalability as a DRAM alternative, PCM must be architected to address relatively long latencies, high energy writes, and finite endurance.We propose, crafted from a fundamental understanding of PCM technology parameters, area-neutral architectural enhancements that address these limitations and make PCM competitive with DRAM. A baseline PCM system is 1.6x slower and requires 2.2x more energy than a DRAM system. Buffer reorganizations reduce this delay and energy gap to 1.2x and 1.0x, using narrow rows to mitigate write energy and multiple rows to improve locality and write coalescing. Partial writes enhance memory endurance, providing 5.6 years of lifetime. Process scaling will further reduce PCM energy costs and improve endurance.

/pdf/architecting-phase-change-memory-as-a-scalable-dram-3v0ii94s6h.pdf

Architecting phase change memory as a scalable dram alternative

This paper mainly focuses on the development of the NOR flash memory technology, with the aim of describing both the basic functionality of the memory cell used so far and the main cell architecture consolidated today. The NOR cell is basically a floating-gate MOS transistor, programmed by channel hot electron and erased by Fowler-Nordheim tunneling. The main reliability issues, such as charge retention and endurance, are discussed, together with an understanding of the basic physical mechanisms responsible. Most of these considerations are also valid for the NAND cell, since it is based on the same concept of floating-gate MOS transistor. Furthermore, an insight into the multilevel approach, where two bits are stored in the same cell, is presented. In fact, the exploitation of the multilevel approach at each technology node allows an increase of the memory efficiency, almost doubling the density at the same chip size, enlarging the application range and reducing the cost per bit. Finally, NOR flash cell scaling issues are covered, pointing out the main challenges. Flash cell scaling has been demonstrated to be really possible and to be able to follow Moore's law down to the 130-nm technology generations. Technology development and consolidated know-how is expected to sustain the scaling trend down to 90- and 65-nm technology nodes. One of the crucial issues to be solved to allow cell scaling below the 65-nm node is the tunnel oxide thickness reduction, as tunnel thinning is limited by intrinsic and extrinsic mechanisms.

Introduction to flash memory

The aim of this paper is to give a thorough overview of flash memory cells. Basic operations and charge-injection mechanisms that are most commonly used in actual flash memory cells are reviewed to provide an understanding of the underlying physics and principles in order to appreciate the large number of device structures, processing technologies, and circuit designs presented in the literature. New cell structures and architectural solutions have been surveyed to highlight the evolution of the flash memory technology, oriented to both reducing cell size and upgrading product functions. The subject is of extreme interest: new concepts involving new materials, structures, principles, or applications are being continuously introduced. The worldwide semiconductor memory market seems ready to accept many new applications in fields that are not specific to traditional nonvolatile memories.

Flash memory cells-an overview

A detailed investigation of electronic switching in chalcogenide-based phase-change memory devices is presented. An original bandgap model consistent with the microscopic structure of both crystalline and amorphous chalcogenide is described, and a physical picture of the switching mechanism is proposed. Numerical simulations provide, for the first time, a quantitative description of the peculiar current-voltage curve of a Ge/sub 2/Sb/sub 2/Te/sub 5/ resistor, in good agreement with measurements performed on test devices.

Electronic switching in phase-change memories

A novel cell structure for chalcogenide-based non-volatile Phase-Change Memories is presented. The new /spl mu/trench approach is fully compatible with an advanced CMOS technology, is highly manufacturable and allows to optimize array density and cell performance. Programming currents of 600 /spl mu/A, endurance of 10/sup 11/ programming cycles and data retention capabilities for 10 years at 110/spl deg/C have been demonstrated. The manufacturability is proven by experimental results from multi-megabit arrays.

Novel /spl mu/trench phase-change memory cell for embedded and stand-alone non-volatile memory applications

A detailed investigation of the reliability aspects in nonvolatile phase-change memories (PCM) is presented, covering the basic aspects related to high density array NVM, i.e., data retention, endurance, program and read disturbs. The data retention capabilities and the endurance characteristics of single PCM cells are analyzed, showing that data can be stored for 10 years at 110/spl deg/C and that a resistance difference of two order of magnitude between the cell states can be maintained for more than 10/sup 11/ programming cycles. The main mechanisms responsible for instabilities just before failure as well as for final device breakdown are also discussed. Finally, the impact of read and program disturbs are clearly assessed, showing with experimental data and simulated results that the crystallization induced during the cell read out and the thermal cross-talk due to adjacent bits programming do not affect the retention capabilities of the PCM cells.

Roberto Bez

Papers

Introduction to flash memory

Flash memory cells-an overview

Electronic switching in phase-change memories

Novel /spl mu/trench phase-change memory cell for embedded and stand-alone non-volatile memory applications

Reliability study of phase-change nonvolatile memories