T
Tatsuya Tsuruga
Researcher at Ibaraki University
Publications - 3
Citations - 30
Tatsuya Tsuruga is an academic researcher from Ibaraki University. The author has contributed to research in topics: Wafer & Grinding. The author has an hindex of 2, co-authored 3 publications receiving 28 citations.
Papers
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Journal ArticleDOI
Fabrication and evaluation for extremely thin Si wafer
Libo Zhou,Bahman Soltani Hosseini,Tatsuya Tsuruga,Jun Shimizu,Hiroshi Eda,Sumio Kamiya,Hisao Iwase,Yoshiaki Tashiro +7 more
TL;DR: In this paper, a new index for evaluation of the degree of subsurface damage (DSD) was proposed, which is easily calculated via the external geometry of the ground wafer.
Journal ArticleDOI
Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer
J. Sasaki,Tatsuya Tsuruga,B.H. Soltani,Takahito Mitsuta,Yebing Tian,Jun Shimizu,Libo Zhou,Hiroshi Eda,Yoshiaki Tashiro,Hisao Iwase,Sumio Kamiya +10 more
TL;DR: In this paper, the influence of the wheel specifications and grinding conditions on the MRR of CMG was investigated and two sets of three-factor two-level full factorial designs of experiment (DOE) were employed to reveal the main effects and interacted effects of the CMG wheel and grinding parameters on MRR.
Book ChapterDOI
Study on Subsurface Damage Generated in Ground Si Wafer
Bahman Soltani Hosseini,Libo Zhou,Tatsuya Tsuruga,Jun Shimizu,Hiroshi Eda,Sumio Kamiya,Hisao Iwase +6 more
TL;DR: In this paper, the subsurface damage of ground wafers to understand the effect of residual stress on the wafer deflection was studied and the experimental results showed that two indexes of depth of the damaged layer and degree of the residual stress are directly associated with the warpage of wafer.