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S. Bizzaglia

Researcher at University of Milan

Publications -  10
Citations -  5268

S. Bizzaglia is an academic researcher from University of Milan. The author has contributed to research in topics: Detector & Tracking (particle physics). The author has an hindex of 5, co-authored 8 publications receiving 4699 citations.

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Journal ArticleDOI

The CMS experiment at the CERN LHC

S. Chatrchyan, +3175 more
TL;DR: The Compact Muon Solenoid (CMS) detector at the Large Hadron Collider (LHC) at CERN as mentioned in this paper was designed to study proton-proton (and lead-lead) collisions at a centre-of-mass energy of 14 TeV (5.5 TeV nucleon-nucleon) and at luminosities up to 10(34)cm(-2)s(-1)
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The CMS Phase-1 pixel detector upgrade

Wolfgang Adam, +799 more
TL;DR: The design and construction of the CMS Phase-1 pixel detector as well as its performance from commissioning to early operation in collision data-taking are described.
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Precision measurement of the structure of the CMS inner tracking system using nuclear interactions

Albert M. Sirunyan, +2497 more
TL;DR: Data from proton-proton collisions at a center-of-mass energy of 13 TeV recorded in 2015 at the LHC are used to reconstruct millions of secondary vertices from these nuclear interactions, determining precise positions of the beam pipe and the inner tracking system elements.
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Beam test performance of prototype silicon detectors for the Outer Tracker for the Phase-2 Upgrade of CMS

Wolfgang Adam, +734 more
TL;DR: In this article, a new CMS tracker detector is installed for operation at the High Luminosity LHC (HL-LHC), which comprises modules with two closely spaced parallel sensor plates and front-end ASICs capable of transmitting tracking information to the CMS Level-1 (L1) trigger at the 40 MHz beam crossing rate.
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Experimental study of different silicon sensor options for the upgrade of the CMS Outer Tracker

Wolfgang Adam, +731 more
TL;DR: In this paper, the performance of different options for the HL-LHC silicon sensors with a focus on silicon bulk material and thickness was compared with different combinations of wafer materials, thicknesses and production technologies.